| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of micro-scratches caused by mixing of foreign matters, enhance uniformity in polishing thickness within the surface of a semiconductor wafer, increase yield, and enhance reliability. SOLUTION: A carrier 12 holds a semiconductor wafer 11 so as to face the surface to be polished upward. A polishing belt 13 moves as it comes in contact with the surface to be polished of the semiconductor wafer and is wound round a wind-up reel 17 through a pulley 18. A conditioning pad 16 conditions the surface of the polishing belt 13. A nozzle 15 supplies slurry to the back surface of the polishing belt 13. A pressing roller 14 is made the slurry on the back surface of the polishing belt to ooze to the surface, and presses the polishing belt and oozed slurry against the surface of the semiconductor wafer. Foreign matters mixed to the slurry are removed with the polishing belt. |
