发明名称 METHOD FOR REMOVING GRINDING/POLISHING/CLEANING MATERIAL ADHERING TO WORKPIECE
摘要 PROBLEM TO BE SOLVED: To surely remove a grinding/polishing/cleaning material coming into the recessed part of, particularly, the worked surface of a workpiece to which blast work is applied by jetting the grinding/polishing/cleaning material. SOLUTION: Considering a workpiece to which blast work is applied by jetting a grinding/polishing/cleaning material, for instance, a low melting-point glass layer 12 having a blast property is formed in the whole surface of the one side of a PDP substrate, a resist layer 13 is formed by patterning in the surface of the low melting- point glass layer 12, and blast work is performed by jetting a grinding/polishing/ cleaning material from the resist layer 13 side whereby the low melting-point glass layer 12 other than the lower layer of the resist layer 13 is polished and removed by the grinding/polishing/cleaning material and a high-accurate rib 14 is formed. All of the grinding/polishing/cleaning materials coming into the gap of the rib 14 cannot be removed by an air blow applied to the surface of the rib 14 side but water-soluble fine particles 23 comprising a water-soluble substance are jetted from the rib 14 side to surely remove the grinding/polishing/cleaning materials 21 by the collision force of the water-soluble fine particles 23 and to replace it with the water-soluble fine particles 23. The PDP is washed, thereby dissolving in water the water-soluble fine particles 23 adhering to the PDP to surely discharge it.
申请公布号 JPH09155743(A) 申请公布日期 1997.06.17
申请号 JP19950322019 申请日期 1995.12.11
申请人 FUJI SEISAKUSHO:KK 发明人 MASE KEIJI;KANDA SHINJI
分类号 B24C1/04;B24C9/00;B24C11/00;H01J9/02;H01J9/227;H01J11/22;H01J11/34;H01J11/36 主分类号 B24C1/04
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