| 摘要 |
PCT No. PCT/JP94/00511 Sec. 371 Date Nov. 29, 1994 Sec. 102(e) Date Nov. 29, 1994 PCT Filed Mar. 29, 1994 PCT Pub. No. WO94/22941 PCT Pub. Date Oct. 13, 1994In a sheet wherein a fabric sheet (A) is impregnated with a resin composition (B) containing poly-p-phenylene sulfide as a major component, by controlling the orientation degree of the resin composition (B) within the range between 0.3 and 0.9, heat resistance, thermal dimensional stability, dielectric characteristics and mechanical properties when bent are largely improved, so that the resin-impregnated fabric sheet may suitably be used as an insulation substrate for circuit boards and for multilayer wiring boards to which high densification of the circuits and decrease in the thickness are demanded.
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