Insulating resin-coated bonding wire

摘要

The present invention provides a bonding wire having a good bonding property, no damage sustained to coatings during bonding, and capability of retaining an excellent insulating property even when wires come into impact with one another in the resin molding step, characterized in that the resin has a thermal weight loss at a temperature of 110 DEG C. in air of not less than 85% and an tensile strength at 180 DEG C. of not less than 300 kgf/cm2. The resins satisfying the specified characteristic conditions can be selected from the group consisting of polyparabanic acid based resins and polyarylate resins.