| 发明名称 |
ADHESIVE, PROCESS FOR THE PREPARATION THEREOF, AND PROCESS FOR MOUNTING COMPONENTS |
| 摘要 |
<p>An adhesive which does not impair components poor in heat resistance, is excellent in storage stability, and little causes sagging due to heating. This adhesive comprises 100 parts by weight of an epoxy resin having a content of mononuclear components of 87 to 100 % by weight, 20 to 80 parts by weight of a latent curing agent, 2 to 40 parts by weight of an inorganic filler, 1 to 15 parts by weight of a thixotropic agent, and 0.1 to 5 parts by weight of a pigment, and is prepared by dispersing and dissolving the epoxy resin and the latent curing agent in each other by heating, cooling the obtained solution, and dispersing the inorganic filler, thixotropic agent and pigment in the resulting solution.</p> |
| 申请公布号 |
WO9720898(A1) |
申请公布日期 |
1997.06.12 |
| 申请号 |
WO1996JP03554 |
申请日期 |
1996.12.04 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;MIYAKAWA, HIDENORI;SUETSUGU, KENICHIROU;FUKUSHIMA, TETSUO;OKAWA, KOJI |
发明人 |
MIYAKAWA, HIDENORI;SUETSUGU, KENICHIROU;FUKUSHIMA, TETSUO;OKAWA, KOJI |
| 分类号 |
C08K3/00;C08L63/00;C09J163/00;H05K3/30;H05K3/34;(IPC1-7):C09J163/00 |
主分类号 |
C08K3/00 |
| 代理机构 |
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