Semiconductor mfr. device, e.g. tape and reel handler, esp. for integrated circuit

摘要

The appts. includes at least one electric and mechanical test device, a marking station (11) and an end packing station (23,24,25) where the components are finally packed for delivery. A transport system (1) is also provided where the components (2) are automatically, successively picked up preferably from a transport packaging of the preparation system. The components are then automatically conveyed without packaging, in a predetermined sequence, to the test stations (9,10) and the marking station. Finally, the components are automatically packed in a selected end packing station. Several packing stations may be coupled to the transport system. The packing stations may be formed differently to selectively pack components into e.g. trays, tubes or tapes. Alternatively, the packing stations may all be identical and arranged in parallel. The transport system may be coupled to a control device where individual data is allocated to each component after testing in the test station. The component may then be conveyed to an appropriate packing station according to the associated data.