Gehäusungssystem, für Feldeffekttransistoren

摘要

In a packaging system 50 for semiconductor components e.g. internally matched field effect transistor ("IMFET") dies 55, individual dies are eutectically bonded to individual FET mounting bars 61. The mounting bar/FET die combination is then eutectically bonded, along with the other components comprising the package, to a package base 51. After a wiring operation, the package is completed by sealing it with a cover (80, Fig. 11 not shown). The system 50 permits the economical correction of micro-voids between the FET dies and the mounting bars.