Data carrier comprising an integrated circuit module

摘要

The electronic module (3) is bonded into a recess (15) in the body (1) of an identification card by means of resin (17) hardened by electron beam irradiation eg. through the back of the card. Contact surfaces (2) are formed on a supporting film (6) in which windows (13, 14) are made for the integrated circuit chip (8) and bond wires (7). To improve the fit of the module in its recess, the surfaces of the latter and/or the film are roughened and a tapered hole (18) is made through the film.