| 发明名称 |
High modulus silicones as toughening agents for epoxy resins |
| 摘要 |
<p>This invention relates to certain new high modulus silicones, toughened epoxy thermoset resin systems made from those silicones and composites that are prepared from the new toughened epoxy resin systems. The silicone resins are specifically monophenyl-containing polysiloxanes. <IMAGE></p> |
| 申请公布号 |
EP0475611(B1) |
申请公布日期 |
1997.06.11 |
| 申请号 |
EP19910307699 |
申请日期 |
1991.08.21 |
| 申请人 |
DOW CORNING CORPORATION;TORAY INDUSTRIES, INC. |
发明人 |
DECKER, GARY THOMAS;TOBUKURO, KUNIAKI;GORNOWICZ, GERALD ALPHONSE |
| 分类号 |
C08L83/04;B32B27/04;C08G77/26;C08G77/28;C08J5/24;C08L63/00;C08L83/08;H05K1/03;(IPC1-7):C08L63/00;C08G59/40 |
主分类号 |
C08L83/04 |
| 代理机构 |
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代理人 |
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