发明名称 MIXTURES OF EXPOXY RESINS FOR PREPREGS AND SANDWICHES
摘要 <p>PCT No. PCT/DE95/01136 Sec. 371 Date Mar. 10, 1997 Sec. 102(e) Date Mar. 10, 1997 PCT Filed Aug. 25, 1995 PCT Pub. No. WO96/07685 PCT Pub. Date Mar. 14, 1996Epoxy resin mixtures to produce prepregs and composites contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from (a) polyepoxy compounds with at least two epoxy groups per molecule and (b) phosphinic acid anhydrides, phosphonic acid anhydrides or phosphonic acid half-esters; dicyandiamide and/or an aminobenzoic acid derivative as the hardener; an amino hardening accelerator.</p>
申请公布号 CZ9700704(A3) 申请公布日期 1997.06.11
申请号 CZ19970000704 申请日期 1995.08.25
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 VON GENTZKOW WOLFGANG;HUBER JURGEN;KAPITZA HEINRICH;ROGLER WOLFGANG;SCHONAMSGRUBERG UWE
分类号 C08J5/10;B32B27/38;C08G59/14;C08G59/20;C08G59/30;C08G59/40;C08G59/50;C08G59/52;C08J5/24;C08L63/00;H05K1/03;(IPC1-7):C08G59/30;C08G59/54;H01L23/29 主分类号 C08J5/10
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