| 摘要 |
The unitary assembly includes the base circuit board (10) which carries micro-components whose outputs are divided at a first step and the supported middle board (12) carries micro-components, certain of which have outputs divided at a second step below the first. The supported board may carry macro-components while micro-components (20) are placed beneath it. Three or four balls (24) of solder, of diameter greater than that of the balls which support the middle board in a two-dimensional network, are placed around the edge of the middle board engage in holes (26) made in the base board so as to centre it. The two boards may be made of different materials using different technologies. |
