| 发明名称 |
Thermosetting resin composition |
| 摘要 |
A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.
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| 申请公布号 |
US5637667(A) |
申请公布日期 |
1997.06.10 |
| 申请号 |
US19950451065 |
申请日期 |
1995.05.25 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SHIMOZAWA, HIROSHI;FUJIEDA, SHINETSU;HAYASE, SHUZI;NAKANO, YOSHIHIKO;YOSHIZUMI, AKIRA;UCHIDA, KEN |
| 分类号 |
C08G77/60;C08L63/00;C08L79/08;C08L83/16;C08L101/00;(IPC1-7):C08G77/04 |
主分类号 |
C08G77/60 |
| 代理机构 |
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