SEMICONDUCTOR DEVICE AND IC CHIP INSPECTING METHOD

摘要

PROBLEM TO BE SOLVED: To facilitate inspecting an IC chip and packaging good products after inspection by electrically connecting the chip to a circuit board having circuits on the surface of an insulating film through an anisotropic conductive film contg. conductive particles dispersed in an insulating adhesive agent resin. SOLUTION: An anisotropic conductive film contg. conductive particles dispersed in an insulating adhesive agent resin is pressed or hot pressed to electrically connect electrodes 10 of an IC chip 1 to an electrode circuit 6 of a circuit board 9 whereby the quality judgment of the chip can easily be made, using electrode terminals of the board 9. If the chip 1 is non-defective after inspection thereof, an adhesive agent resin 4 of the film 2 is hardened at a higher temp. and high pressure and then the chip 1 can be readily mounted on the board 9.