| 摘要 |
PROBLEM TO BE SOLVED: To attain high speed operation and high functions without increasing manhour for development. SOLUTION: A CPU core, peripheral circuits, a built-in ROM, and a built-in RAM are formed on a microcomputer chip 101. An emulation control circuit for controlling the whole emulation is formed on an emulation function chip 102. First electrode pads 103 formed on the function face of the chip 101 and second electrode pads 104 formed on the function face of the chip 102 are electrically connected through connection bumps 105, and in the connected state of both the pads 103, 104, the chips 101, 102 are moduled by the use of insulating resin 106. |
