| 摘要 |
PROBLEM TO BE SOLVED: To improve the electric connection reliability of a semiconductor element to inner leads of a tap carrier by forming stud bumps on Au plated inner leads and bonding the bumps en bloc to electrode pads on the semiconductor element by a bonding tool. SOLUTION: The surface of inner leads 5 is plated with Au to form a carrier tape. Stud bumps 7 are formed by the Au wire bonding on the inner leads 5 located at the centers of electrode pads 9 on a semiconductor element 8, accurately positioned to the pads 9 and bonded en bloc by the stress, heat or ultrasonic energy of a bonding tool 11. This enables the assembly of a stud bump type TPC at high yield, without cracking the pads 9 and parts beneath them. |
