| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the assembly of an application device. SOLUTION: A device 101 is provided with a heat sink 51 for dissipating the loss heat of an IGBT element 11, which is a power semiconductor element, to the external heat dissipating fin. External terminals 5 and 6 to be connected to the external circuit board are protruded in the direction that the exposed plane of the heat sink 51 faces. Thus, at the time of assembling an application device by mounting the device 101 on the external circuit board with other circuit elements, the device 101 and other circuits can be arranged on the common major plane of the circuit board, namely, on the major plane on the opposite side to the side whereupon the heat dissipating fin is to be mounted. Thus, solder can be applied at one time on the common major plane of the circuit board, and the device 101 and other circuit elements can be soldered at one time. |
