发明名称 |
Apparatus and method for removing known good die using hot shear process |
摘要 |
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
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申请公布号 |
US5636781(A) |
申请公布日期 |
1997.06.10 |
申请号 |
US19950462369 |
申请日期 |
1995.06.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
OLSON, DAVID C.;PHILLIPS, III, ROBERT |
分类号 |
B23K1/018;G01R1/04;G01R31/28;H01L21/60;H05K13/04;(IPC1-7):H05K3/30;B23K3/00 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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