发明名称 |
Lead frame assembly for a semiconductor device |
摘要 |
A lead frame assembly for a semiconductor device includes a lead frame having a lead frame main body and a first welding region, and a die pad frame having a die pad frame main body, a die pad frame, and a second welding region for welding to the first welding region of said lead frame main body. At least one of the first and second welding regions includes a welding pad for welding to the other welding region and a support bridge connected between the welding pad and a respective frame main body, supporting the welding pad from the respective frame main body, the support bridge including an element for suppressing transmission of at least one of mechanical force, heat, and electrical current. |
申请公布号 |
US5637917(A) |
申请公布日期 |
1997.06.10 |
申请号 |
US19960626956 |
申请日期 |
1996.04.03 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
TOMITA, YOSHIHIRO;KIMURA, MICHITAKA;KASHIBA, YOSHIHIRO |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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