MANUFACTURE OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND LEAD FRAME

摘要

PROBLEM TO BE SOLVED: To eliminate the affect of dross adhesion, improve flatness accuracy of lead leading edge and lead pitch accuracy after bending the leads and eliminate troubles due to dross dropping. SOLUTION: In the lead frame process prior to mounting a a semiconductor chip, half etching part 25 is previously formed on both the planes of a dam bar 24. The half etching part 25 is formed on the further side than a resin mold part 22. The dam bar 24 is cut by applying laser beams while discharging assist gas from a nozzle. The quantity of dross 27 is remarkably reduced and the dross 27 is stored in the half etching part 25.