| 摘要 |
FIELD: electronic engineering. SUBSTANCE: device has several groups of identical redundant components made in the form of chips or chip fragments. Novelty is that redundant components are placed on connecting board and coupled to its contact pads; in addition, device has decoder; identical redundant components are stacked so that each similar contact pad of any identical component is arranged strictly under or above similar contact pad of other redundant components and either all similar contact pads of each identical component of stack, except for set of supply voltage contact pads, or all similar contact pads of each identical component of stack, including supply voltage contact pads, are interconnected. All components and board are either placed inside package or covered with sealing compound. If set of supply voltage contact pads of identical components is isolated, device is provided, in addition, with switches to connect power buses of bard isolated supply voltage contact pads of each component of stack, and decoder is coupled with all switches. If all similar contact pads of identical components are interconnected, each chip is provided with one or more redundant fragments, and leads of one or more supply voltages of each redundant fragment are connected to respective voltage contact pads connected to board power buses through switches. In this case, each chip is provided, in addition, with encoder connected to isolated group of chip contact pads coupled by supply voltages and all switches of all fragments, and decoder is connected to isolated groups of stack contact pads. EFFECT: improved design. |
