| 摘要 |
PROBLEM TO BE SOLVED: To enhance moisture proofness, thereby enhancing reliability by providing a redundancy circuit, a fuse layer, a layer insulating layer and a passivation layer. SOLUTION: This device is provided with a fuse part in which a fuse layer 1 is formed and a bonding pad part in which a bonding pad layer 3a is formed. In the fuse part, a layer insulating layer 2 comprising a silicon oxide or the like is formed so as to cover the fuse layer 1 comprising a conductive material or the like. In the surface of the layer insulating layer 2 located right above the fuse layer 1, a recessed part 2a having the open width W1 of a size which is the plane width of the fuse layer 1 or above is formed. Therefore, the thickness (d) of the layer insulating layer 2 located above the fuse layer 1 can be reduced, thereby being able to easily blow the fuse layer 1 by a laser. |
