发明名称 |
Solder application to a circuit board |
摘要 |
Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.
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申请公布号 |
US5637833(A) |
申请公布日期 |
1997.06.10 |
申请号 |
US19950463346 |
申请日期 |
1995.06.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BANKS, PETER M.;MORGAN, WILLIAM M. |
分类号 |
B23K1/06;B23K1/08;B23K3/06;B23K101/42;H05K1/00;H05K3/28;H05K3/34;(IPC1-7):H05K1/00 |
主分类号 |
B23K1/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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