发明名称 Solder application to a circuit board
摘要 Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.
申请公布号 US5637833(A) 申请公布日期 1997.06.10
申请号 US19950463346 申请日期 1995.06.05
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BANKS, PETER M.;MORGAN, WILLIAM M.
分类号 B23K1/06;B23K1/08;B23K3/06;B23K101/42;H05K1/00;H05K3/28;H05K3/34;(IPC1-7):H05K1/00 主分类号 B23K1/06
代理机构 代理人
主权项
地址