| 摘要 |
PROBLEM TO BE SOLVED: To realize the connection of this film in a short period of time, have excellent storage stability at normal temperature and excellent adhesion within wide temperature range after curing under heat and pressure, and, addition, realize extremely small residual strain at a joint and separation and re-fixing by pressure by heating films fixed by pressure up to the predetermined temperature or higher. SOLUTION: The essential components of this film are polyvinyl butyral resin A having characteristics such as the degree of polymerization of 1,500-2,500, the degree of acetylation of 3mol.% or less, the degree of butyralation of 65mol.% or more, the flow softening point of 200 deg.C or higher, epoxy resin B, microcapsulated imidazole derivative epoxy compound C, solvent D and electroconductive particle E prepared by putting metal covering onto the surface of polymer spherical nuclear material. A paste-like mixture, the mixing ratio in weight of the above components of which satisfies the relationship: A/(B+C)=(10-50)/1,000, is cast on a releasing film and turned into a film by volatilizing solvent. |
