| 摘要 |
PROBLEM TO BE SOLVED: To prevent a chip crack and the disconnection of wiring after a lead frame is mounted and press-fitted and during a temperature cycle by fixing a lead frame to a semiconductor chip through a light-sensitive thermosetting resin layer. SOLUTION: The distinctive constitution of the package of LOC structure is that a light-sensitive thermosetting resin polyimide series resin layer 64 is laminated on the passivation film 13 of an IC chip 10. A soft error due to αrays from the filler of a sealing resin 18 is prevented and at the same time, a lead frame 11 which has bus bars 42, 43, signal lines 44, 45 and support pin parts 60, 61 on the resin layer 64 is thermally press-fitted. Namely, it is noteworthy that the light-sensitive thermosetting polyimide series resin layer 64 provided on an IC chip functions as a second protective film and at the same time functions as an adhesive agent to the lead frame 11 and an insulating tape is not used. |
