| 摘要 |
PROBLEM TO BE SOLVED: To reduce the expense required for maintenance of a polishing device and its peripheral equipment without worsening polishing ability and polishing quality, by simultaneously employing chemical and mechanical polishing. SOLUTION: A polishing fluid, dispersing an abrasive grain of superfine grain size as an abrasive presenting mechanical polishing action by 50 to 100g/l concentration in an oxalic acid water solution of 1 to 10% concentration presenting chemical polishing action, is prepared. This polishing fluid is used for specular polishing of stainless steel. |
