| 摘要 |
PCT No. PCT/JP94/00449 Sec. 371 Date Sep. 8, 1995 Sec. 102(e) Date Sep. 8, 1995 PCT Filed Mar. 18, 1994 PCT Pub. No. WO94/21833 PCT Pub. Date Sep. 29, 1994The present invention provides a Pd alloy thin wire for wire bonding semiconductor elements comprising Ca, Al, Cr and Si each in an amount of up to 0.0003% by weight, from 0.001 to 0.01% by weight of In, optionally one or both of Au and Ag each having a purity of at least 99.99% in respective amounts of 0.001 to 2.0% by weight and 0.001 to 5.0% by weight, and the balance Pd having a purity of at least 99.99% by weight and unavoidable impurities. The Pd alloy thin wire exhibits an excellent loop shape compared with that of an Au alloy thin wire, ensures bonding reliability, and can replace an Au bonding wire.
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