发明名称 |
TAB TAPE AND METHOD FOR PRODUCING IT |
摘要 |
A TAB (tape automated bonding) tape of high precision is formed by providing a metal support (10) and adhering a conductor pattern (20) to it by an electrically insulating adhesive (12). Such a tape does not deform and can be hermetically sealed with resin. A method for producing such a TAB tape includes punching required holes, such as a device hole (14) in a metal plate (10) coated with an insulating adhesive layer (12) over the area where a conductor pattern is to be formed; and forming a required conductor pattern (24) by bonding a conductor metal foil onto the adhesive layer and etching the conductor metal foil. The material cost of this TAB tape is less and the production is facilitated. <IMAGE> |
申请公布号 |
KR970009271(B1) |
申请公布日期 |
1997.06.09 |
申请号 |
KR19930014683 |
申请日期 |
1993.07.30 |
申请人 |
SHINKO ELECTRIC IND.KK. |
发明人 |
KODANI, KOTARO;KOYANAGI, KAZUO;SATO, KIYOKAZU |
分类号 |
H01L21/48;H01L23/495;H05K1/05;H05K1/09;H05K3/40;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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