| 摘要 |
PROBLEM TO BE SOLVED: To prevent metallic brazing material for sealing from fusing wiring for earth, when sealing a cap, by providing a hole in a second ceramic board for stopping the flow of the metallic sealing brazing material a the time of sealing the cap. SOLUTION: A semiconductor container comprises the first and second ceramic boards 2A and 28 equipped with metallized patterns for mounting semiconductor elements and electrically connecting the semiconductor elements to external terminals, and a hollow ceramic layer 21 having a metallized layer 13 for performing airtight sealing with the sealing metallized layer 15 of the cap 14. And, holes 4A and 4B for stopping the flow of the sealing material are provided in the region in contact with the hollow ceramic layer 21, and they are connected electrically with the earth metallized pattern 3 made at the first ceramic board 2A. Hereby, the holes 4A and 4B effect the role of stopping the flow of metallic sealing brazing material at the time of sealing the cap, and can prevent the fusion of the metallic wiring for earth. |
