| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a multilayer printed wiring board having no problem such as oozing out of a resin insulating layer and a skip between circuit parts and in which the resin insulating layer and a conductor layer are alternately built up with sufficient adhesive strength with good productivity and a low cost. SOLUTION: A photosetting and thermosetting first resin insulating composite containing resin being soluble in a developer is applied to the surface of a wiring board 1 in which conductor circuits 2a, 2b are formed so as to bury the conductor circuits followed by irradiation with ultraviolet rays so as to form the first resin insulating layers 3a, 3b soluble in the developer. Later, thereon a photocuring and thermosetting second resin insulating composite containing a particulate rubber component and/or a filler dissoluble or soluble by a roughening agent is is printed as prescribed for being subjected to ultraviolet ray irradiation so as to form the second resin insulating layers 4a, 4b. Next, after removing portions of the first resin insulating layers 3a, 3b not covered by the second resin insulating layers 4a, 4b by developing processing followed by heating curing to be later processed by the roughening agent so as to form a conductor layer 7 on the formed rough surface. |
