METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD MANUFACTURED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of multilayer printed wiring board. SOLUTION: Polyimide resin ink 21 and 22 is printed for covering conductor circuits 11' and 12' provided on both sides of a core material 10. Pre-preg 31 and 32 are provided on the surface of the polyimide ink 21 and 22. A core material 41a and 42a on which a copper foil is placed on the pre-preg 31 and 32. Thermo-compression bonding is made to form a laminate. Through holes 51 and 52 are formed by making holes and giving plating on the laminate. Conductive circuits 61 and 62 are formed by etching on the copper foil of the outermost layer.