| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily assemble an optical device without using the bonding resin and the thermal deformation device which are heretofore in use by a method wherein an optical semiconductor element is positioned and fixed in an outer case. SOLUTION: This device is provided with optical semiconductor elements 21 and 22 and an outer case 23 having light transfer slits 30 and 31 and integrally houses the optical semiconductor elements 21 and 22. The outer case 23 is provided with element housing recessed parts 28 and 29 having an upward opening, and optical semiconductor elements 21 and 22 are housed in the recessed parts 28 and 29.</p> |
