| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method which enables optimum control of the quantity of conductive bond attached to a tail in adhering an electronic component having a bump with a tail to a work. SOLUTION: A second nozzle 15 for vacuum-sucking an electronic component 4 having a bump is moved to above a storage section 16 for conductive bond 12. The electronic component 4 having a bump is lowered, and the lower end of a tail 9 protruding downward from a bump 8 is pressed to the bottom surface of the storage section 16. Thus, the lower ends of all the tails 9 have the same height. By then lifting up the electronic component 4 having a bump, the optimum quantity of the conductive bond 12 may be attached to all the tails 9. Subsequently, the electronic component 4 having a bump is transported to above a work and loaded on the work with the bump 8 aligned with a pad of the work.
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