| 摘要 |
PROBLEM TO BE SOLVED: To improve running stability at the time of working, enable high density patterning, and facilitate position alignment at the time of semiconductor chip mounting, by forming a circuit on an aromatic polyimide film satisfying specific conditions, coating the circuit with insulating coating material, and forming a coating layer by heating and drying. SOLUTION: Aromatic polyimide film is used which satisfies the following; biphenyl tetracarboxylic acid component and paraphenylenediamide component are contained as main units, the thickness is 12-250μm, the curling degree is A4-B1, the thickness gradient showing thickness variation is at most 3μm per 10mm in the width direction, the water absorption is at most 18%, the tensile elastisity is at least 500kg/mm<2> , the coefficient of linear expansion (50-200 deg.C) is at most 2.5×10<-5> cm/cm/ deg.C, and the micro Vickers hardness is at least 30. A circuit is formed on the film, and insulating coating material is applied to the circuit. By heating and dying, a coating layer is formed. Thereby running stability at the time of working is improved, and high density patterning is enabled.
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