| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board excellent in the microminiatured circuit formation and a method of manufacturing such a wiring board by a conventional production system and simply. SOLUTION: This wiring board has a plurality of insulating layers, a plurality of wiring layers, a via hole for performing connection of neighboring wiring layers, a recessed part for mounting electronic parts. Now, in order to manufacture this wiring board, firstly, a wiring board with a formed terminal for mounting connected to an inner layer wiring layer and the adhesive surface of an insulating adhesive layer with an applied insulating adhesive are piled up so that the adhesive surface may come in contact with the side of an inner layer circuit for being integrally laminated by heating and pressing. Then, the whole surface of the integrally laminated board is plated and the copper foil of the part forming the recessed part is selectively removed by etching and an insulating adhesive layer exposed on the part where the copper foil is removed by etching is selectively removed by etching, further, the copper foil on the needless part is selectively removed by etching.</p> |
