| 摘要 |
PROBLEM TO BE SOLVED: To obtain high reliability and high productivity without any deterioration in transmission characteristic by plating a conductive film with Ni and further plating the nickel film with solder, and then forming an input/output electrode. SOLUTION: The conductive film covering the outside surface of a dielectric block and a through hole wall is formed by applying, for example, Ag paste by dipping, dried for 10 minutes at a temperature of 120 deg.C, and baked by being placed in an atmosphere and in a reductive atmosphere. The conductive film is >=10μm thick. Then a barrel is used to plate the conductive film Ni by electrolytic plating to 0.2-1.0μm and further the Ni-plated film is plated with solder to 1-3μm. In this case, the Ni-plated film is a protective film which prevents Sn in the solder coating component from being diffused to the conductive film. Consequently, cracking and electrode peeling due to the stress of the plated film of the input/output electrode and the corrosion of ceramic due to plating liquid can be prevented. |
