SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To attempt making a low thermal resistance without cost up when an LSI of cavity down system is assembled. SOLUTION: A through hole 3 is made at the central part of a cavity 1 of a base substrate 2, the rear surface 4B of a semiconductor chip 1 is exposed by the through hole 3 and resin 9 which seals the semiconductor chip 4 is filled into the cavity 1. After wire bonding and resin filling under the condition of the semiconductor 4 being temporally fixed by such an inexpensive material as a heat-proof tape, such construction is obtained by the heat-proof tape being eliminated. Therefore the semiconductor 4 of which rear surface 4B is exposed can be manufactured by a simple method.