| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesiveness between undercoating material and copper foil and to ensure sufficient properties of laminate without black treatment of circuits on internal layer. SOLUTION: By this method of manufacturing a multilayer printed wiring board, a pre-preg consisting of a substrate impregnated with a thermosetting resin and dried is overlaied on the circuit surface of the copper-clad laminate with circuit patterns and pressed for lamination. On the circuit surface of the copper-clad laminate prepared by the above method, (1) a terminal bifunctional group straight-chain polymer epoxy resin whose average epoxy equivalent is 450 or more and 6000 or less, (2) a resol or a resol and a novolak, and (3) an undercoating material whose essential component is a curing accelerator are applied and dried. Then a pre-preg consisting of a substrate impregnated with an epoxy resin and dried is overlaid and pressed for lamination. |
