发明名称 |
LAMINATE FOR PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a laminate in which the adhesive strength between copper foil layer and insulating base material is high by using SPS (resin composition containing polymer of styrene having syndiotactic structure) of superior dielectric property. SOLUTION: A laminate is mainly comprised of an SPS resin 3 and an insulating base material of fibrous filler with a copper foil layer 1 on at least one side. Several copper particles 2 protrude from the copper foil layer 1 into the insulating base material. The diameter of the copper particles 2 to 0.1-5μm. More than 50% of the particles are spaced 1μm or less.
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申请公布号 |
JPH09148733(A) |
申请公布日期 |
1997.06.06 |
申请号 |
JP19950309037 |
申请日期 |
1995.11.28 |
申请人 |
SHIN ETSU POLYMER CO LTD |
发明人 |
ODAJIMA SATOSHI;MIENO SATOSHI |
分类号 |
B32B15/08;B32B15/20;B32B27/04;B32B27/30;H05K1/03;H05K3/38;(IPC1-7):H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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