| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the occurrence of cracks in sealing resin so as to improve heat radiation property as well as improve reliability, by forming space part for absorbing bias, at a metallic board which does not have moisture absorption property, and forming sealing resin at the metallic plate so as to cover both obverse and reverse of an element mount. SOLUTION: An element mount 26 on which to mount a semiconductor element 21 is made at the center of the bottom opposed to a mounting board 28 of a metallic board 24. At the center position of the element mount 26, a space part 27 is made to pierce the metallic board 24. And, sealing resin 23 is made at the metallic board 24 so as to cover both the obverse 26a and reverse 26b of the element mount 25. Therefore, the bias brought about at the metallic board 24 by the heat at the time of forming the element mount 26 by bending processing is absorbed by the space part 27, and the flatness of the element mount 26 and the metallic board 24 is maintained. Accordingly, trouble is prevented such as that the semiconductor element 21 exfoliates from the element mount 26, and the reliability on the semiconductor device 20 can be improved.</p> |
