| 摘要 |
PROBLEM TO BE SOLVED: To obtain a probe formed to give the profile image and the thermal image of a semiconductor device. SOLUTION: The probe 10 comprises a first ribbon of material 11 and a second ribbon of material 12 forming a thermocouple joint 13. The probe 10 is fixed with epoxy 14, at the forward end 15 thereof, to the thermocouple joint 13. In another embodiment, a probe 20 is provided with a point region 17 by bending a part of thermocouple joint 13 and the point region 17 is coated with a thermally conductive material. An optical signal is reflected on the first ribbon of material 11, the second ribbon of material 12 or the flat part of thermocouple joint 13 and the movement of probe 10, 20 can be monitored by means of a photodetector. |
