| 摘要 |
PROBLEM TO BE SOLVED: To reduce eccentricity, thickness balance or warpage by sticking a first disk substrate with a second disk substrate based on a first sticking mark and a second sticking mark. SOLUTION: After disk substrates 21AX and 22AX are molded, first and second reflection film layers 21B and 22B are formed on the rugged pattern surfaces 21A and 22A of the disk substrates 21AX and 22AX respectively. Then, the disk substrates 21 and 22 are stuck each other by an adhesive 23 making signal recording surfaces 21c and 22c sides sticking surfaces so that respective answering marks of marks 21E1 -21E4 and marks 22E2 -22E4 formed on the disk substrates 21 and 22 match with each other. In such a case, since the marks 21E1 -21E4 and the marks 22E1 -22E4 are recorded, and they are formed on a stamper, the complexity that the marks are formed whenever the disk substrates 21 and 22 are formed is evaded. |
