| 摘要 |
PROBLEM TO BE SOLVED: To decrease the dimensional variations within the shot surface on a wafer. SOLUTION: The translucent films exhibiting the exposure transmittance meeting the sizes of the pattern parts through which exposing light passes are formed in the exposing light transparent parts on the photomask pattern surface of the photomask for a reduction stepper having circuit patterns consisting of metallic thin films 2, etc., on a quartz substrate 1. As a result, the quantity of the exposure light transmitting the light transparent parts is controlled and the quantity of the light arriving at the wafer is made uniform and, therefore, the dimensional variations within the shot surface on the wafer occurring in the variations in the pattern sizes within the mask surface which occurrence at the time of mask production are decreased. |
