| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a circuit device free from high frequency signal attenuation due to the impedance mismatch of high frequency signal wires. SOLUTION: Earth potential bonding pads 11 are arranged on both sides of a high frequency signal bonding pad 4. In the part between two neighboring high frequency semiconductor chip elements 1, the bonding pads 4 and package side transmission lines are connected by using a high frequency signal wire 2 and earth potential wires 12 which are arranged parallel with the high frequency signal wire 2. The wires 2, 12 constitute a pseudo coplanar type high frequency transmission line. Thereby the characteristic impedance of the pseudo coplanar type high frequency transmission line can be matched with that of a high frequency transmission line 6, so that attenuation of a high frequency signal which is to be caused by the impedance mismatch between the high frequency signal wire 2 and the high frequency semiconductor chip element 1 can be prevented.</p> |
