TRANSFER PIN AND METHOD OF TRANSFERRING ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a pin for transferring adhesive, which has adhesive-carrying fingers arranged on the periphery of the tip so that the thickness, quantity and shape of adhesive applied to a die pad can be easily controlled when a semiconductor sensor chip is mounted. SOLUTION: A columnar pin 8 is used to transfer adhesive to a die pad on which a semiconductor pressure sensor chip with a silicon diaphragm is mounted. The pin 8 has adhesive-carrying fingers 8d arranged at predetermined intervals on the periphery of the tip. When the pin 8 is pressed on a tray holding adhesive, the air staying in the middle of the tip of the pin escapes through the spaces between the fingers 8d, and thus a uniform thickness of adhesive is held on the fingers.