LEAD FRAME, SEMICONDUCTOR INTEGRATED CIRCUIT USING THE FRAME AND WIRE BONDING

摘要

PROBLEM TO BE SOLVED: To prevent leads oscillation during wire bonding by an oscillation preventing member with a belt shape having insulating and hard characteristics being made to adhere to a lower surface of bonding part of inner leads by means of junctioning neighbor leads with each other. SOLUTION: A belt shape tape (an oscillation preventing member) having insulating and hard characteristics and preventing oscillation of leads 6 caused by a capillary operation during inner leads 6b bonding is made to be so bonded that the neighbor leads 6 are junctioned with each other. This means the tape 11 is cut into a necessary size and made to adhere to a lower surface of a bonding part 10 after a lead frame 1 is made to a predetermined form. Here a recess part 12a for preventing deformation of the leads 6 to which the tape 6 is bonded is formed in a heat block 12 of a wire bonding device which makes wire bonding of the lead frame 11 and is junctioned with the tape 11.