Manufacture of power semiconductor device in packaged chip

摘要

The manufactured component consists of a housed chip with a lead frame (5) with electric coupling pins (3) on a frame (1) of low thickness and a metal part of greater thickness as a heat sink (4), which protrudes from the housing. The manufacture uses at least two corresponding structured strips of different thickness, the thinner one with several lead frames and the thicker one with several heat sinks. The component parts have the same dividing configuration for corresponding contacting. They are welded together by resistance welding. The strips are of different metals, or their alloys.