Conductive adhesive for bonding e.g. semiconductors to circuit boards

摘要

The electrically conductive adhesive comprises: (A) conductive particles with a surface that comprises at least one of nickel or a nickel/boron alloy and has been treated with a polyoxyalkylene phosphate compound/polyoxyalkylene alk(en)ylamine (derivative) mixture; (B) an epoxy compound containing 20-70 wt.% diglycidylepoxy compound as reactive thinner (w.r.t. the weight of epoxy compound); and (C) a phenolic resin curing agent containing at least 50 wt.% alkyl resol phenolic resin and/or alkyl novolak phenolic resin (w.r.t. curing agent). Also claimed are circuits comprising a semiconductor, chips and separate or combined components that have been bonded to a circuit board using the above adhesive.