| 摘要 |
<p>A semiconductor device wherein a semiconductor chip (1) is adhered via a jointing metal (2) to one face of a heatsink (4) composed of a material having a coefficient of thermal expansion close to that of the semiconductor chip (1); the heatsink (4) is adhered via a silicone adhesive (5) having a modulus of elasticity of 10 MPa or less to a frame (3); to the frame (3) is adhered a TAB tape (9) via an epoxy adhesive (6); and the semiconductor chip (1) is sealed with a sealing epoxy resin (8) having a modulus of elasticity of 10 GPa or more and thus protected from the environment.</p> |
