A tin alloy sputtering target has a back plate joined to the sputter source material by soldering with a solder consisting of 27-68 wt.% bismuth, 32-73 wt.% tin and less than 5 wt.% indium, antimony, lead, silver or copper. Pref. the solder has the eutectic composition of 57 wt.% Bi and 43 wt.% Sn.
申请公布号
DE19647478(C1)
申请公布日期
1997.06.05
申请号
DE19961047478
申请日期
1996.11.16
申请人
LEYBOLD MATERIALS GMBH, 63450 HANAU, DE
发明人
WEIGERT, MARTIN, DR., 63457 HANAU, DE;SCHULTHEIS, MARKUS, 36043 FULDA, DE
