Polishing method, semiconductor device fabrication method, and semiconductor fabrication apparatus

摘要

Chemical mechanical polisher is disclosed. A polishing slurry stored in a polishing slurry tank (41), used in this polishing contains a solvent and polishing particles dispersed in the solvent. The polishing particles are selected from silicon nitride, silicon carbide, and graphite. The material (6, 12, 16) to be polished is polished by using this polishing slurry.